Snapdragon 885 is manufactured by Samsung using the 5 nm process, Snapdragon 895 by TSMC using the 4 nm process

The Qualcomm Snapdragon 875 will hit the market earlier than its predecessors. Qualcomm has confirmed that it will be officially launched on December 1st .

The first smartphone with the new flagship SoC on board will hit the market in January 2021, at least two months earlier than in previous years.

The Qualcomm Snapdragon 875 will use an EUV process - the Samsung 5-nm LPE process. In addition, the SoC will adopt the '1 + 3 + 4' cluster architecture with three octa cores. The single large core will have a clock frequency of 2.84 GHz, three A78 cores will have a clock frequency of 2.42 GHz, and four A55 cores will have a clock frequency of 1.8 GHz.

The Adreno 660 GPU will also be on board. This chipset will use the Qualcomm Secure Processing Unit (SPU250), the Spectra 580 image processing engine and also the Snapdragon Sensors Core Technology. For connectivity, the SD875 supports external 802.11ax, 2 × 2 MIMO and Bluetooth Milan interfaces. This chipset also supports 3G / 4G / 5G mmWave and sub-6 GHz bands.

Qualcomm Snapdragon 885

Qualcomm has already started work on its next-generation flagship SoC. The Snapdragon 885 is slated to hit the market later in 2021. Of course, the current specs are unknown, but it will continue to use Samsung's 5nm process, possibly an improved version of the 5nm LPP process.

Qualcomm Snapdragon 895

As for the Qualcomm Snapdragon 895 in 2022, there are no detailed specs. Qualcomm will likely use TSMC again for this generation of chips, just like with the Snapdragon 855 & 865.

The Snapdragon 895 will likely use TSMC's 4nm process. Further details are not yet known.

Sources):
GizChina

The article Snapdragon 885 is manufactured by Samsung in the 5 nm process, Snapdragon 895 by TSMC in the 4 nm process first appeared on Xiaomist .