Huawei's current chairman Guo Ping recently released a message to Huawei employees saying the company will continue to invest in HiSilicon.
Huawei will continue to work with front-end partners to improve and build its own semiconductor manufacturing capabilities in the coming years.
"I believe that in a few years we will have a stronger HiSilicon"
Guo Ping
The current situation of the Kirin chips will cause some difficulties especially for high-end cell phones, but it is believed that these problems can be solved.
Last month, the US government increased its pressure on chipmakers to stop doing business with Huawei and not make or sell any new chips to the Chinese company.
Following this, Huawei's Consumer Business CEO Richard Yu announced that there would be no new manufacturing of top-of-the-line Kirin chipsets after September 15, 2020.
At the same time it was confirmed that the elimination of Google Mobile Services (GMS) for Huawei smartphones had led to difficulties in overseas markets. Nevertheless, it seems to be satisfied with the results that Huawei Mobile Services (HMS) have achieved since its introduction in 2019.
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Huawei Central
The post Huawei will continue to invest in HiSilicon to expand its chip manufacturing capabilities first appeared on Xiaomist .
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